News on September 24, according to foreign media reports, TSMC has been at the forefront of the industry in chip foundry in recent years. Their technical level is leading, and they have also won a large number of chip foundry orders. Apple, AMD and many other companies have chips. They are all handed over to TSMC.
But in addition to the chip foundry business, TSMC actually also has a chip packaging business. They currently have several chip packaging factories, and they are still developing new packaging technologies and building more advanced chip packaging factories.
The latest reports from foreign media show that TSMC plans to put into operation two new advanced chip packaging factories in the next two years.
According to the information on TSMC’s official website, they currently have 4 advanced chip packaging and testing factories, and they will increase to 6 after the new two are put into production.
Foreign media reports also show that the two chip packaging factories that TSMC plans to put into production in the next two years will use 3D Fabric advanced packaging technology. At TSMC’s 2020 Global Technology Forum and Open Innovation Platform Ecosystem Forum at the end of August, they announced this advanced packaging technology.
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